Behind the Build

How we build, ship, and scale technology for modern credit trading, from the team doing the work.

July 21, 2026

Part 2 of the Trumid AI Journey Series

At Trumid, we view our products as an ongoing conversation with our clients. Every feature, UI tweak and latency improvement is our half of it. Whether we're responding to direct feedback or anticipating a market need, the goal is the same: rapidly build a solution, put it in the client's hands, and ask, 'Did we hear you?'

HS-Ray-Chen-20260707 (1)

Ray Chen, Director of Data and Intelligence

April 23, 2026

Part 1 of the Trumid AI Journey Series

For more than a decade, the narrative of U.S. credit markets was defined by “electronification,” the move from phones to screens that transformed bond trading. Today, we are entering an even more dynamic phase, one that is defined by intelligent automation.

Tony Schiavo, Chief Technology Officer at Trumid

Tony Schiavo, Chief Technology Officer​

Make the next move.

Help build the products and trading workflows shaping the future of electronic credit trading.

Why AI, Why Now?

At Trumid, we’ve always believed that better technology, higher-quality data, and intentional product design could fundamentally reshape how corporate bonds trade. And AI, as you might imagine, dramatically expands that belief.

Tony Schiavo, Chief Technology Officer​
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Make the next move.

Help build the products and trading workflows that are shaping the future of electronic credit trading.

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At Trumid, we view our products as an ongoing conversation with our clients. Every feature, UI tweak, and latency improvement is our half of it. Whether we’re responding to direct feedback or anticipating a market need, the goal is the same: rapidly build a solution, put it in the client’s hands, and ask, ‘Did we hear you?’